TGS participates in the 2025 Small Business and Enterprise Technology Fair, co-hosted by the Carbon Nano Association.
페이지 정보
작성자 TGS
작성일
26-02-11
본문
TGS participated in the "2025 Materials, Components, and Equipment Root Technology Fair (Tech Inside Show 2025)" held at KINTEX
in Ilsan from October 29th (Wednesday) to 31st (Friday), 2025, hosted by the Korea Institute for Advancement of Technology (KIAT)
and co-hosted by the Korea Carbon Nano Industry Association.
At this exhibition, TGS showcased its Cu–Diamond (arCuDia) heat dissipation substrate,
which garnered significant attention from experts and visitors from various industries.
This exhibition was a meaningful opportunity to share the key achievements of companies working on mass production performance enhancement projects
and to showcase their technological competitiveness in the field of high-heat conductive materials.
TGS will continue to lead the global market with innovative heat dissipation material technologies.