Width : ~ 108mm
Length : ~ 108mm
Thickness : ≥1.0 mm
Patented unique Structure
Hole, Ear, Rectangular type
Surface finishing : Cu, Ni, Au
Applicable to Ag-Brazing (800℃)
Copper-Diamond New composite Material
Heat spreader with strain balanced structure
high performance heat dissipation substrates with higher TC and lower CTE
The world's highest performance heat dissipating substrate for semiconductor packages
| Model | *SbS-Dia | SbS-MoCu | |
|---|---|---|---|
| Structure | Cu/MoCu/CuDia /MoCu/Cu |
Cu/MoCu/CuDia /MoCu/Cu |
|
| Dia. Volume ratio | 30%±5% | - | |
| Internal Structure Image |
 |
 |
|
| CTE (ppm/K) |
RT | 8.4 | 12.5 |
| RT~200°C | 9.1 | 11.8 | |
| RT~400°C | 9.2 | 9.5 | |
| RT~800°C | 9.1 | 8.1 | |
| Thermal conductivity (W/m K) | ~600 | ~360 | |
| Thickness (mm) | 1.0 ≤t | 0.25 ≤ t | |
01Solid bonding interface
02No cracks / No bowing / No voids
03No delamination in bonding interface
