더굿시스템

APPLICATIONS

  • APPLICATIONS
  • APPLICATION
  • X-ray Target

    <X-ray Target>

    Cu-W

    Structure of X-ray target

    W/Cu-Diamond Target

    • W/Cu-Dia in a single piece
    • No Brazing material
    • Thermal conductivity ≧ 1000W/mK

    W/Cu Bonding Strength Test

    • W/Cu bonding strength is superior to the reference.

    Roadmap for X-ray target material

    1st Stage

    • Good usage for current structure
    • Applicable 800℃ Ag Brazing
    • Thermal conductivity ≧ 800W/m·k

    2st Stage

    • W/Cu-Dia in a single piece
    • No Brazing material
    • Thermal conductivity ≧ 1000W/m·k
    • Optimization for customer’s design

    3st Stage

    • CVD-Diamond (~ 1500 W/mK) on X-ray emission point
    • No interface between heat spreader and heatsink
    • Optimization for customer’s design

    Key technology for 3rd stage X-ray Target


    THE GOODSYSTEM CORP.
    Add : 125, Mongnae-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
    Tel : 82-31-494-2522/Fax : 82-31-494-2525