THE GOODSYSTEM
TGS has independently developed new diamond composite materials and stress-balanced structure (SbS), leading the industry's technological direction.
We create new value through customized heat-dissipation materials and internal structural design that meet customer needs in applications such as 5G wireless communications, EVs, IoT, and AI.
As a result, we provide global customers with world-class heat spreader for semiconductor packages.
TECHNOLOGYORIENTED
PRODUCTORIENTED
CUSTOMERORIENTED
CREATIVITYORIENTED
TGS CEO
TGS exists for our customers and is never afraid to take on new challenges.
The materials and components manufacturing industry is expected to expand, focusing on two key application areas: autonomous electric vehicles and ultra-high-speed wireless communications, which will drive the Fourth Industrial Revolution. Power semiconductors are at the heart of electric vehicle inverters and converter modules, while RF amplifier semiconductors are at the heart of next-generation wireless communication transmission and reception modules. Recently, the autonomous electric vehicle sector demands high-power and high-frequency semiconductor chips to meet the demands of high-capacity, high-speed charging and zero-latency data transmission, while the 5G wireless communications sector demands ultra-high-speed data transmission from 10 Mbps/m2 to 20 Gbps.
Along with improvements in semiconductor device performance, the "heat generation" that occurs during device operation is a secondary determining factor in semiconductor device efficiency. "Semiconductor device performance and heat dissipation characteristics," which determine the reliability of the final system, are inseparable and interdependent factors. The thermal characteristics of the "heat dissipation substrate for semiconductor packages" are a critical material component in determining this.
TGS has independently developed a new copper-carbon composite material and a stress-balanced structure, enabling the commercialization of heat-dissipating substrates with higher thermal conductivity and lower thermal expansion than competitors. Currently, we are able to provide global customers with the world's highest-performance heat-dissipating substrates for semiconductor packages. The core of this product lies in the understanding of "thermal characteristic changes due to internal stress" in multi-junction heat-dissipating substrates, enabling the design of optimized, customized heat-dissipating characteristics. This heat-dissipating substrate design technology "increases the freedom in selecting heat-dissipating materials and substrate structures," enabling the implementation of a wider range of products.
TGS High-Performance Heat Dissipation Board will do its best to become an eco-friendly company that can contribute to the realization of a "high-efficiency 4th industrial revolution."
CEO, The Goodsystem Corp.(TGS)
Vice President, LATTICEPOWER Ltd.
CEO/CTO, Wavesquare Inc.
Associate Professor, Applied Physics, Tohoku Univ.
Project Manager, LG Electronics Technology Research Institute
It will grow rapidly to become a leading developer
of high-performance base plates for semiconductor packages.
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THE GOODSYSTEM CORP.(TGS)+82-31-494-2522
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