더굿시스템

APPLICATIONS

  • APPLICATIONS
  • APPLICATION
  • CPU, GPU, Data Center

    Data Centers, CPU/GPU

    Example of Diamond structure for CPU

    · Design flexibility for 3D diamond placement
    · Adjusting the coefficient of thermal expansion to match the semiconductor chip
    · NO interface, NO TIM between heat spreader and heatsink

    THE GOODSYSTEM CORP.
    Add : 125, Mongnae-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
    Tel : 82-31-494-2522/Fax : 82-31-494-2525