더굿시스템

APPLICATIONS

  • APPLICATIONS
  • APPLICATION
  • 5G / 6G Wireless communication

    TGS products applicable to Ceramic Brazing Package

    No bowing after Ceramic Brazing ( < 20 um )

    • 5.84x20.32x1.52 mm³

    • 9.8x19.57x1.4 mm³

    • 41.2x10.2x0.92 mm³

    • 9.8x20.6x1.02 mm³

    Cross-section (after 1000cycles)

    GaN/SiC Die bonded at 300℃ with AuSn

    · Solid bonding interface
    · No cracks/No bowing/No voids
    · No delamination in bonding interface

    X-ray CT images


    THE GOODSYSTEM CORP.
    Add : 125, Mongnae-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
    Tel : 82-31-494-2522/Fax : 82-31-494-2525