Width : ~ 108mm
Length : ~ 108mm
Thickness : ≥0.7 mm
Patented unique Structure
Hole, Ear, Rectangular type
Surface finishing : Cu, Ni, Au
Copper-Diamond New composite Materials
high performance heat dissipation substrates with higher TC and lower CTE
The world's highest performance heat dissipating substrate for semiconductor packages
| Model | *arCuDia | |||
|---|---|---|---|---|
| Structure | Copper-Diamond | |||
| Dia. Volume ratio | 45±5% | 35% ±5% | arCuDia 35%+Cu Cladding(100㎛) | |
| Internal Structure Image |
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| CTE (ppm/K) |
RT | 7.2 | 8.5 | 9.1 |
| RT~200°C | 8.4 | 9.7 | 10.1 | |
| RT~400°C | 9.3 | 10.5 | 10.7 | |
| RT~800°C | 10.5 | 11.7 | 12.0 | |
| Thermal conductivity (W/m K) | ~1000 | ~800 | 600~650 | |
| *Values may vary depending on the upper and lower Cu skin thickness. | ||||
| Thickness (mm) | 2.0 ≤t | 0.7 ≤ t | Cu 100㎛ /CuDia 800㎛ / Cu 100㎛ | |
01Solid bonding interface
02No cracks / No bowing / No voids
03No delamination in bonding interface
