arCuDia / SbS-Dia.

Heat spreader for extreme applications

• Dimension
• - Width : ~ 108mm
• - Length : ~ 108mm
• - Thickness : ≥0.7 mm

• Features
• - Patented unique Structure
• - Hole, Ear, Rectangular type
• - Surface finishing : Cu, Ni, Au
• - Ag-Brazing (800℃) is available
• - Copper-Carbon New Composite Materials
• - Heat spreader with strain balanced structure
• - high performance heat dissipation substrates with higher TC and lower CTE
• - The world's highest performance heat dissipating substrate for semiconductor packages